CO₂ laser (10.6 μm) works well for pure PI film and simple outlines where copper traces are not close to the cut line. UV laser (355 nm) is preferred for FPC with copper layers — its shorter wavelength ablates the polymer without thermally loading the copper, preventing trace discolouration, delamination, and adhesive bleed. For multi-layer flex with tight trace-to-edge clearances under 0.3 mm, UV is the correct choice.

Yes. We regularly cut multi-layer flex stacks in a single pass. Before production we run test cuts on a sample of your stackup to confirm the parameters produce clean inter-layer separation with no adhesive bleed at the cut edge. Please provide your full stackup spec (layer order, thicknesses, adhesive type) when requesting a quote.

Our UV laser can cut slots and features as small as 0.1 mm wide. For internal holes, the minimum diameter is approximately 0.2 mm. Practical minimum varies with film thickness — thicker multi-layer stacks require slightly larger minimum features due to kerf width and material relief. Include your tightest feature dimensions in your drawing and we’ll confirm feasibility at quoting stage.

Yes. For semiconductor and medical customers we provide serialised job records, first-article inspection (FAI) reports with dimensional measurements, and lot traceability documentation. If your application requires specific quality records for PPAP, IPC, or ISO 13485 submissions, please specify this when enquiring so we can confirm what documentation we can provide.

Roll-to-sheet cutting is available on request for standard PI and PET film rolls up to 300 mm wide. We unwind, flatten, and cut to your specified sheet dimensions before laser processing. For high-volume orders requiring continuous roll-fed laser cutting, please contact us to discuss production volume and setup requirements.